(2)Examples of good and bad solder application
Item
Not recommended
Lead wire of component
Recommended
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Component placement close to
the chassis
Solder (for grounding)
Electrode pattern
Lead wire of component
Solder-resist
Hand-soldering of leaded
Soldering iron
Solder-resist
components near mounted
components
Solder-resist
Horizontal component
placement
◆Pattern configurations (Capacitor layout on PCBs)
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
possible mechanical
Items
Deflection of board
Not recommended
Recommended
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
E
D
Perforation
C
A
Slit
B
Magnitude of stress
A>B=C>D>E
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
Precautions
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
相关PDF资料
HPH-12/30-D48NB-C CONV DC/DC 12V 30A 360W
HPQ-12/25-D48PBH-C CONV DC/DC 300W 12V 25A POS LOG
HPQ-3.3/50-D48NB-C CONV DC/DC 165W 3.3V 50A
HPR100WC CONV DC/DC SGL 5V 150MA SMD
HPR1023C CONV DC/DC +/-15V +/-34MA SIP
HPR103C CONV DC/DC +/-5V +/-75MA SIP
HPR117VC CONV DC/DC +/-15V +/-25MA DIP
HPR403C CONV DC/DC +/-5V +/-75 SIP
相关代理商/技术参数
HMK107B7223KA-T 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP MIDHI VOL 0603 100V X7R .022uF 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
HMK107B7332KA-T 制造商:TAIYO YUDEN 功能描述:Cut Tape 制造商:Taiyo Yuden 功能描述:Ceramic capacitor 0603 X7R 100V 3.3nF 制造商:Taiyo Yuden 功能描述:Cap Ceramic 0.0033uF 100V X7R 10% SMD 0603 125°C Paper T/R
HMK107B7333KA-T 制造商:TAIYO YUDEN 功能描述:Cut Tape 制造商:Taiyo Yuden 功能描述:Ceramic capacitor 0603 X7R 100V 33nF
HMK107B7472KA-T 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP MIDHI VOL 0603 100V X7R .0047uF 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
HMK107B7682KA-T 制造商:TAIYO YUDEN 功能描述: 制造商:TAIYO YUDEN 功能描述:Ceramic capacitor 0603 X7R 100V 6.8nF
HMK107BJ102KA-T 制造商:TAIYO YUDEN 功能描述:Cut Tape 制造商:TAIYO YUDEN 功能描述:Ceramic Multilayer Capacitor 制造商:Taiyo Yuden 功能描述:Ceramic capacitor 0603 X5R 100V 1nF 制造商:Taiyo Yuden 功能描述:Cap Ceramic 0.001uF 100V X5R 10% SMD 0603 85
HMK107BJ103KA-T 制造商:TAIYO YUDEN 功能描述:Cut Tape 制造商:TAIYO YUDEN 功能描述:Ceramic Multilayer Capacitor 制造商:Taiyo Yuden 功能描述:Ceramic capacitor 0603 X5R 100V 10nF 制造商:Taiyo Yuden 功能描述:Cap Ceramic 0.01uF 100V X5R 10% SMD 0603 85
HMK107BJ104KA-T 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP MIDHI VOL 0603 100V X5R .1uF 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel